Er-X6001 Bga Rework Machine

Advertisement No:	#00080433
Category:	BGA Rework Machine
Brand:	Sinerji
Model Type:	ER-X6001
Product Type:	For Sale
Product Status:	New
Origin:	Other
Location:	Mehmet Nezihi Özmen Mah. / Güngören / İstanbul

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Sinerji Bilgisayar

Sinerji Sanal Mağzacılık Bilgisayar San. ve Tic. Ltd. Şti

Advisor : Sinerji S.

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Delivery Time: Immediate Delivery

Product Features:

* The first Bga Rework Machine in Turkey with Turkish language support.

* Allows you to remove chips in an average of 4 minutes.

* With its zoom-enabled camera, you can monitor the chip removal and installation processes simultaneously from the BGA screen.

* Easy to use thanks to the touch LCD screen.

* Manufactured with high-quality heating elements. The entire heating system is from Siemens. It has a professional control mechanism for precise chip installation and removal on motherboards.

* Provides ease of use. Can move freely on the horizontal axis.

* Allows easy programming with PC connection. Offers the ability to view real-time profiles, set profiles, and profiles tested in practice.

* Unlimited profile saving, ability to analyze two profiles tested in practice, English language support in addition to Turkish.

* There are tightly controlled upper and lower hot air fans to keep the set working temperature constant. The infrared at the bottom of the machine ensures that chip removal and installation processes are safer and more efficient through temperature control of the stable heat zone.

* The frame supporting the PCB used for BGA chip removal and installation is adjustable at a micrometric level to prevent potential regional collapses on the board.

* The lower heating area is quickly cooled by a high-power wide-area fan.

* Adjustable PCB placement supports are designed to position PCBs that do not have a proper geometry, such as notebook motherboards, quickly for chip soldering or removal.

* After the BGA chip soldering or removal process is completed, the user is alerted by a signal. The vacuum pump that needs to be used to lift the BGA chip starts to operate automatically and becomes ready.

* Both upper and lower hot air heaters are equipped with over-temperature protections for the safety of the BGA workstation and the work being done. They are highly resistant to high temperatures.

* With easily replaceable hot air blowing nozzles of different sizes and shapes, special applications can also be performed in addition to standard applications.

* BGA Machine's integrated design allows for efficient operation in small spaces.

Technical Specifications:
* Power Supply: AC220V ± 10% 50Hz / 5KW
* Power Consumption: 4.8KW
* Heater – Main Heater: 800W
* Lower Heater: 1.2KW
* Infrared Element: 2.7KW
* Electrical Material: PLC, supports computer communication. It has a large TFT LCD screen.
* Temperature Control: K-type closed-loop independent upper and lower temperature control, temperature error ± 3 °.
For PCB placement
* Positioning: Adjustable PCB placement supports are designed to quickly position PCBs that do not have a proper geometry, such as notebook motherboards, for chip soldering or removal.
* Machine Size: 850 × 680 × 700mm
* Weight: 75kg

Including VAT: 19,457.02 TL

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