25-28 Pieces/Minute Wafer Baking Oven

 Makren s used for the fully automatic production of shaped or flat wafers.

Wafer molds are designed according to customer requirements for pattern and thickness.

The molds for baking the wafers are heated using natural gas, LPG, or electricity.

Baking time varies between 2 and 3.5 minutes, depending on the wafer thickness and recipe.

The gas system uses cast burners to ensure energy savings.

The burner moves left and right to ensure equal heat distribution across the baking surface.

The heating system is automatically ignited, and it can be easily monitored from the control panel.

The wafer baking oven is equipped with a frequency-controlled main motor.

A frequency-controlled impeller pump is used for dough delivery. This ensures the dough is evenly delivered to the molds in the desired weight.

The adjustable automatic sheet removal system ensures smooth flow of wafers to the subsequent cooling machine.

The bead cleaning system at the bottom can be controlled automatically or manually from the control panel.

The automatic temperature control device allows for easy monitoring of the mold temperature from the control panel.

The external covers of the wafer baking oven are made of stainless steel.

The tong tension system is pneumatically controlled.

The gas system is enclosed with stainless steel covers to prevent damage.

Wafer Mold and Locking System Options:

• Oven 290 X 470 – 44 Mold: 18 – 20 pcs/min, Butterfly locking system

• Oven 290 X 470 – 60 Mold: 24 – 26 pcs/min, Butterfly locking system

• Oven 350 X 470 – 60 Mold: 25 – 28 pcs/min, Hook locking system

• Oven 350 X 470 – 80 Mold: 34 – 36 pcs/min, Hook locking system

• Oven 350 X 470 – 90 Mold: 40 – 42 pcs/min, Hook locking system

• Oven 350 X 500 – 60 Mold: 25 – 28 pcs/min, Hook locking system

• Oven 350 X 500 – 80 Mold: 34 – 36 pcs/min, Hook locking system

• Oven 350 X 500 – 90 Mold: 40 – 42 pcs/min, Hook locking system

The wafer baking oven is used for the fully automatic production of flat or shaped wafers.

Wafer molds can be designed to create fine or medium-depth patterns, as required.

The baking molds are heated using natural gas, LPG, or optionally by electricity.

The baking time can be adjusted between 2 to 3.5 minutes, depending on the wafer thickness and recipe. The average baking time is 2.3 minutes. The system is equipped with energy-efficient burners.

Each burner moves around its axis to ensure uniform heat distribution across the entire baking surface.

The heating system is automatically ignited and monitored from the control panel.

The oven includes a frequency-controlled main motor, a frequency-controlled impeller pump for dough delivery, an automatic sheet removal system, an automatic temperature control device, stainless steel coating, a closed exhaust hood at the dough delivery station, a pneumatic-controlled automatic tong tension system, a bottom bead cleaning system, control panel, and control cabinet.

Payment Terms in Turkey: 50% prepayment, 50% after shipment.