Flat Wafers And Chocolate Enrobed Wafers Productıon Line

Operation of the Line:

All kinds of cream-filled flat/hollow wafers are produced on semi or fully automatic production lines. The process is as follows:

1. The dough is mixed and prepared. The wafer batter is produced in batches.
2. The prepared dough (the batter) is deposited onto the baking plates at the batter depositing station of the automatic wafer baking machine.
3. According to the preselected baking time and baking temperature, the wafer sheets are baked, automatically discharged and transferred onto the further processing line. Depending on the desired capacity, the baking ovens might be equipped with 30 to 90 baking plate pairs.
4. The wafer sheets are taken from the oven and cooled down to room tempreature through wafer sheet coolers. While being transported from the oven through the wafer sheet cooler, the wafer sheets are cooled down to room temperature.
5. The cooled wafer sheets transferred to the cream spreading machine where the cream is applied on the wafer sheets. There is a special cream production plant for the preparation of the cream fillings. The spreading machine applies this prepared cream filling by the film method. Before the wafer sheets are stacked according to the preselected number, the cover sheet is placed on top and the wafer books are calibrated to achieve the required thickness.
6. Cooled creamy wafer sheets are put on each other as books and the wafer books in the desired layers and formats are received in this way.
7. The wafer books are cut in the desired dimensions and received as wafer fingers or wafer bars.
8. Finally, depending on the product desired, the cut wafers are conveyed directly onto the packaging machine or transferred to a downstream chocolate coating plant before packaging processes.